Curriculum and Instruction Action Item |
DATE: Tuesday, October 16, 2007
TO: School Board Members
FROM: MaryEllen Elia, Superintendent
SUBJECT / RECOMMENDATIONS
EXECUTIVE SUMMARY
Through the School Improvement Plans, schools implement a collaborative and ongoing process for improvement that aligns with the district goals and schools’ student data. The purpose of the School Improvement Plan is to provide a current description of students and their performance along with a system of goals, interventions, and data analysis to improve student performance. Schools develop their SIP with all stakeholders and submit full documentation for 2007/2008. Throughout the school year, the SIP is a working document that captures adjustments to the school’s strategies as a result of ongoing data analysis and continued efforts to meet the needs of all students.
The Office of School Improvement reviews all plans and works with schools to ensure compliance and expected standards. Waivers have been voted on and approved by each school’s faculty and SAC. Appropriate district-level staff reviewed and approved the schools’ requested waivers. The language of all waivers submitted (with the exception of one) has been previously approved by the School Board. Eisenhower Middle School is submitting a waiver request for a policy change that is new to the Board for approval. This waiver, which results in more teacher-parent communication, is attached for your review (page 61).
All School Improvement Plans and required documents are available for review on the District Website at www.sdhc.k12.fl.us/SIP, Enter School Site Number, CLICK Enter, CLICK My SIP Report.
ANNUAL DISTRICT GOAL(S) AND CRITICAL SUCCESS FACTOR(S)
FINANCIAL IMPACT (Budgeted: Yes)
EVALUATION
SUBMITTED BY:
Deborah H. Rodgers, Ed.D.
Administrator on Special Assignment, School Improvement and Accountability (813) 272-4224 |
Michael A. Grego, Ed.D.
Assistant Superintendent, Curriculum and Instruction (813) 272-4221 |
A 1.04 | |
Hillsborough County Public Schools (Florida) * Mtg.#20071016_268 * Section A Item# 1.04 |